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Blog tagged as Industry News

Design Pressures Rise for Test Boards in Advanced Package Validation

2025/06/12 05:50 PM By Charles - Comment(s)

        In recent years, semiconductor test platforms have rapidly advanced toward high-frequency operation, multi-module integration, and thermal cycling validation. With the rise of mmWave, RF, and chiplet architectures, the associated test PCBs (load boards) are facing new des...

Integrated GaN ICs deliver higher efficiency, power density and system reliability

2021/09/22 01:59 PM By Will.Hsu - Comment(s)

Texas Instruments announced its gallium nitride (GaN) technology and C2000™ real-time microcontrollers (MCUs) are being combined with Delta Electronics' high-efficiency power electronics expertise in the design of an enterprise server power-supply unit (PSU) featuring an 80% improvement in powe...

TPCA Show Taipei

2021/09/08 02:04 PM By Will.Hsu - Comment(s)
TPCA Show Taipei

Due to global cencerns related to COVID-19, TPCA complies with the government's epidemic prevention regulations to ensure the health and safety of all paticipants.

TPCA Show TAIPEI 2021, orginally scheduled for Oct.20-22, is officially postponed to a later date.


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TAITRONICS 2021 Show

2021/01/29 04:37 PM By Altra - Comment(s)
TAITRONICS 2021 Show include OPTO TAIWAN 2021, Laser & Photonics Taiwan 2021 and TPCA Show 2021

Online Seminar for Experiment Comparison of Yoshikura Fully Insulated Wires VS. Japanese Triple Insulated Wires 

2020/10/23 03:15 PM By Will.Hsu - Comment(s)
Yoshikura Fully Insulated Wire vs. Japanese Triple Insulated Wire Does Yoshikura fully insulated wire really have better performance than Triple Insulated Wire?

How is non-solvent varnish prepared?

2020/10/23 10:00 AM By Altra - Comment(s)
When using non-solvent varnish, it needs to be matched with a curing agent (catalyst). How to select an appropriate ratio according to the production conditions to improve production efficiency is the key.
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