Altra Tech. Incorporated 益瑞電子股份有限公司 - Blog #Industry NewsAltra Tech. Incorporated 益瑞電子股份有限公司 - Blog #Industry Newshttps://www.altra.net/blogs/tag/industry-newsTue, 14 Apr 2026 02:26:18 -0700http://zoho.com/sites/<![CDATA[Design Pressures Rise for Test Boards in Advanced Package Validation]]>https://www.altra.net/blogs/post/2025-test-board-design

        In recent years, semiconductor test platforms have rapidly advanced toward high-frequency operation, multi-module integration, and thermal cycling validation. With the rise of mmWave, RF, and chiplet architectures, the associated test PCBs (load boards) are facing new design challenges. Whether it’s ensuring high-speed signal integrity, efficient heat dissipation, or structural stability in large-format boards, even slight deviations can lead to data distortion or unreproducible failure modes during validation.

        Particularly over the past year, the pace of high-frequency adoption has accelerated, while package validation timelines have become increasingly compressed. This has further elevated the role of test board design. In one example, socket contact instability occurred during burn-in testing. The root cause was traced to minor board warpage from repeated high-temperature cycles, resulting in compression misalignment between the package leads and socket contacts—ultimately compromising data consistency.

        In wafer-level IC testing, the Z-axis coefficient of thermal expansion (CTE) of the board material directly impacts the contact stability between the IC and the probe. On multi-point compression platforms, the board’s ability to maintain flatness under heat stress becomes even more critical. In addition, controlled trace width and consistent impedance are essential for ensuring measurement accuracy at high speeds. These requirements cannot be guaranteed by layout specifications alone—they demand a synthesis of material selection, layer stack-up strategy, and manufacturing precision.

        As validation demands grow increasingly complex, the role of the test board is also evolving. It is no longer merely a passive carrier, but a highly customized platform that must align with verification logic while meeting mechanical and thermal reliability requirements. Stability and precision are baseline needs; signal and structural consistency under dynamic conditions is what defines a capable board today.

        Against this backdrop, partners with expertise in multilayer board design, knowledge of high-speed behavior, and agile support for sample iteration and manufacturing tuning have become essential collaborators throughout validation workflows.

        We’ve observed that in high-frequency, high-temperature validation environments, the stability and structural integrity of test boards are rapidly becoming potential bottlenecks in the test flow. Maintaining signal and mechanical consistency under dynamic operating conditions is no longer just a matter of material choice—it’s a systemic challenge involving both design and production. As we continue to track these evolving application scenarios, we welcome the opportunity to exchange insights if your team is facing similar challenges in test development.


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]]>Thu, 12 Jun 2025 17:50:07 +0800<![CDATA[Integrated GaN ICs deliver higher efficiency, power density and system reliability]]>https://www.altra.net/blogs/post/GaN-and-High-efficiency-power

GaN technology & high-efficiency power electronics

Texas Instruments announced its gallium nitride (GaN) technology and C2000™ real-time microcontrollers (MCUs) are being combined with Delta Electronics' high-efficiency power electronics expertise in the design of an enterprise server power-supply unit (PSU) featuring an 80% improvement in power density with 1% better efficiency — up to 99.2% — for data center applications, compared to enterprise server power supplies using a traditional architecture. A 1% improvement equals 1-megawatt (or 800 households) total cost of ownership savings per data center, according to Energy Innovation


Delta Electronics, a global leader in power- and thermal-management solutions and a leading AC/DC, DC/DC and DC/AC power systems provider for a wide range of applications -- including IT, electric vehicle charging, appliances and industrial power -- chose TI due to its decade-long investment in GaN technology as well as its real-time control solution with C2000 MCUs. TI uses innovative semiconductor manufacturing processes to manufacture GaN-on-silicon technology and integrated circuits (ICs) to help companies such as Delta Electronics create differentiated applications to more efficiently power data centers around the world.


TI and Delta Electronics will co-present an "industry insight" session — "The Impact of GaN Technology and What It May Mean for Future Industrial Designs" — during the TI Live! Tech Exchange virtual event, Sept. 27-29, 2021. During the event, TI experts will discuss power management, automotive, real-time control, vision sensing and design trends in a series of keynotes, roundtable discussions, technical sessions and demonstrations.

For more information, see TI.com/gan.


source : Texas Instruments

]]>Wed, 22 Sep 2021 13:59:28 +0800<![CDATA[TPCA Show Taipei]]>https://www.altra.net/blogs/post/tpca-shows-taipei Due to global cencerns related to COVID-19, TPCA complies with the government's epidemic prevention regulations to ensure the health and ]]>

TPCA Show TAIPEI 2021 Schedule Postponed

Due to global cencerns related to COVID-19, TPCA complies with the government's epidemic prevention regulations to ensure the health and safety of all paticipants.

TPCA Show TAIPEI 2021, orginally scheduled for Oct.20-22, is officially postponed to a later date.


Exhibition Date: 12/21(Tue.)~12/23(Thur.)

Venue: Taipei Nangang Exhibition Center, Hall 1, Ground Floor(1F)


source : TPCA

]]>Wed, 08 Sep 2021 14:04:54 +0800<![CDATA[2021 CWIEME Shanghai]]>https://www.altra.net/blogs/post/cwieme-shanghai-2021-27-29-april

2021 CWIEME Shanghai

CWIEME Shanghai is APAC professional exhibition for coil winding, electric motor and transformer manufacturing suppliers to showcase their latest technologies, products, services and equipment and share successful application cases and solutions. It helps participant keep on top of emerging trends and industry developments and help build long-term, sustainable business relationships with local & worldwide partners. It’s where businesses from East and West meet in one convenient place, allowing you to connect with key influencers and decision makers.

Exhibition Dates

27th ~ 20rd Apr, 2021


Exhibition Venue

Shanghai World Expo Exhibition & Convention Centre


Official Website 

http://www.coilwindingexpo.cn/en

]]>Thu, 15 Apr 2021 17:40:23 +0800<![CDATA[2021 NEPCON China]]>https://www.altra.net/blogs/post/2021-NEPCON-China

2021 NEPCON China

NEPCON China 2021 (The 30th Presentation of NEPCON Microelectronics China 2021) will open from 21st to 23rd April, 2021 at the Shanghai World Expo Exhibition & Convention Centre. As a grand international gala for the electronics manufacturing industry, this upcoming exhibition will focus on showcasing equipment and technology in SMT, soldering and adhesive dispensing, testing and measurement, new electronics materials, and other related fields.

As we celebrate the 30th anniversary of NEPCON China, we are joining hands with IOTE 2021 to concurrently stage these two shows in Shanghai, bringing a complete facelift for NEPCON to the audience. The upcoming exhibition will attract some 700 exhibiting firms and brands to showcase cutting-edge products and innovative solutions to an expected influx of over 50,000 professional visitors coming from fast-growth sectors and fields such as consumer electronics, as well as 5G, telecommunication, smart home, IoT, automotive electronics, medtronics, semiconductor packaging, and digital manufacturing.

Exhibition Dates

21st ~ 23rd Apr, 2021


Exhibition Venue

Shanghai World Expo Exhibition & Convention Centre



Official Website 

https://www.nepconchina.com/en-gb.html

]]>Wed, 24 Feb 2021 17:00:18 +0800<![CDATA[Online Seminar for Promotion of VOC standard are becoming more and more stringent. How to deal with the selection of Vanish? 2/3(Wed) 1500-1600]]>https://www.altra.net/blogs/post/VOCWebniar
 Thank you for joining, this Webinar has ended successfully.
If you fail to participate in time or want to get more about the content, you can refer the following documents.



[Registration Link]

Please click on the link below and fill out the registration information.


Do you know?
From 2020 Dec., the new version of industrial protective coating standard is effective！
What is the impact of the new version VOC restrictions on the safety regulations of Vanish?
What kind of items can Showa Denko (Hitachi Chemical) solvent-free WP2008 Vanish be used for?


ALTRA will hold an online seminar on on Feb. 3(Wed) 1500-1600 to introduce the features and benefits of Showa Denko (Hitachi Chemical) Varnish.

Welcome to come and give advice. 


[Activity Note]

1. This activity is an online seminar, and please fill in the registration information completely. 

2. Altra reserves the right to review the registration qualifications. Please do not fake the identity of others to avoid breaking the law.

3. Altra reserves the right to adjust the content of the activity. If the time is changed, the updated notice will be given.

4. In case of force majeure factors, such as natural disasters, epidemics, etc., in accordance with the regulations announced by the Administrative Bureau of Personnel Administration of the Executive Yuan, it is decided whether to postpone or not without further notice. Thanks for your consideration for any inconvenience caused

]]>Fri, 29 Jan 2021 16:37:00 +0800<![CDATA[TAITRONICS 2021 Show]]>https://www.altra.net/blogs/post/taitronics-2021-show

TAITRONICS 2021 Show
include ​OPTO TAIWAN 2021,  Laser & Photonics Taiwan 2021 and TPCA Show 2021

Exhibition Dates & Hours

October 20th,10 a.m.–5 p.m.

October 21th,10 a.m.–5 p.m.

October 22nd,10 a.m.–4 p.m.


Exhibition Venue

Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1)


Official Website 

https://www.taitronics.tw/en/index.html

]]>Fri, 29 Jan 2021 16:37:00 +0800<![CDATA[2021 Taipei AMPA/ Autotronics Taipei]]>https://www.altra.net/blogs/post/2021-Autotronics-Taipei

2021 Taipei AMPA / Autotronics Taipei

Physical Show Date and Time

Apr. 14-16 9 a.m.~5 p.m.

Apr. 17 9 a.m.~3 p.m.

Physical Show Venue
Nangang Exhibition Center, Hall 1 (TaiNEX 1)

Features

Taipei AMPA & AutoTronics Taipei is:

The only show in Asia that connects automobile and motorcycle industry in one place.

Asia’s 2nd largest automotive trade show, serving A.C.E.S. that keeps you ahead of the curve.

The show where procurers and key decision makers account for over 85% of the visitors.

Asia's pioneering automotive trade fair where virtual meets reality.


Official Website：https://www.taipeiampa.com.tw/en/index.html

]]>Mon, 18 Jan 2021 16:46:00 +0800<![CDATA[Online Seminar for Experiment Comparison of Yoshikura Fully Insulated Wires VS. Japanese Triple Insulated Wires ]]>https://www.altra.net/blogs/post/webinar-KFIW-3

Actual combat!

Yoshikura Fully Insulated Wire vs. Japanese Triple Insulated Wire

Does Yoshikura fully insulated wire really have better performance than Triple Insulated Wire?


Voltage resistance, thermal shock resistance and direct solderability of wires are the focus of many R&D and field engineers when selecting materials. In this online seminar, these three aspects will be further explained.


We will also live test the solderability of Triple Insulated Wire and Yoshikura's Fully insulated wire! Don’t miss it!


ALTRA will hold an online seminar on Nov. 4 (wed) 1500-1600 to discuss the key metrics for each of TIW and FIW.

Welcome to come and give advice. 

[Registration Link]

Please click on the link below and fill out the registration information.

https://meeting.zoho.com/meeting/register?sessionId=1042348718


[Activity Note]

1. This activity is an online seminar, and please fill in the registration information completely. 

2. Altra reserves the right to review the registration qualifications. Please do not fake the identity of others to avoid breaking the law.

3. Altra reserves the right to adjust the content of the activity. If the time is changed, the updated notice will be given.

4.In case of force majeure factors, such as natural disasters, epidemics, etc., in accordance with the regulations announced by the Administrative Bureau of Personnel Administration of the Executive Yuan, it is decided whether to postpone or not without further notice. Thanks for your consideration for any inconvenience caused


]]>Fri, 23 Oct 2020 15:15:00 +0800<![CDATA[How is non-solvent varnish prepared?]]>https://www.altra.net/blogs/post/non-solvent-varnish

Compared with solvent-based vanity water, non-solvent vanity water has the advantages of fast drying, low volatility, environmentally friendly, low-temperature baking, and storage convenience. However, when using non-solvent varnish, it needs to be matched with a curing agent (Catalyst). How to select an appropriate ratio according to the production conditions to improve production efficiency is the key.


Ⅰ. The proportion of Vanish and hardener

We take Hitachi Chemical's Vanish WP-2952F-2GY for transformers as an example:


Under normal circumstances, the amount of catalyst added is about 1% to 3% of Vanish. The more the catalyst is added, the faster the reaction (curing) speed and the beter the efficiency will be, but at the same time the stress becomes higher and the cost is slightly higher.

We suggest adding about 2% of catalyst is a better choice.

Vanish: Catalyst = 100: 2, in order to effectively increase the reaction rate, the baking time should be shortened, thereby improving production efficiency.

            

Ⅱ. Mixing management of Vanish

After Vanish and catalyst are mixed, they must be stirred evenly before use to achieve better use efficiency. The proceed is as follows:

      1. In a suitable container, add the required varnish, weigh and record. (Photo 1)

      2. Weigh the corresponding curing agent at a ratio of 2%, and add it to the vanity water in step 1. (Photo 2)

      3. Stir immediately. Pay attention to the vanity water on the wall and bottom of the container which should be stirred evenly.

                 A. Use a blender to mix about 5 minutes.

                 B. Manually stir for 10 minutes.

      4. Add diluent and stir again for about 5 minutes.

      5. Do not stir too fast to avoid air bubbles. Confirm that there is no foaming in Vanish; if there is foaming, please wait for the bubbles to disappear before             using(about 30 minutes).


        For the convenience of customers, our packaging directly matches the on-site configuration.

        Hitachi Vanish WP-2952F-2GY 18Kg/barrel

        Catalyst CT-48 0.36Kg/can

        When using it, just use one bucket of Vanish with one can of catalyst.


Ⅲ. Vanish management method

1.  When storing vanish and catalyst, avoid direct sunlight and keep the temperature below 35℃.

2.  Fireworks and heat sources are strictly prohibited.

3.  Mixing water and other substances is prohibited.

4.  Manage and use according to the first-in first-out method


Related Products

Hitachi Chemical's non-solvent varnish is one of the leading brands in the market. There are many types, meeting various UL temperature requirements (150~220℃); it can be matched with mainstream EIS specifications and suitable for transformers, stators and rotors of electric tools, etc.

]]>Fri, 23 Oct 2020 10:00:00 +0800