• _csp_line_me_R_ti_p_@193wjxdy

Blog by Charles

Design Pressures Rise for Test Boards in Advanced Package Validation

2025/06/12 05:50 PM By Charles - Comment(s)

        In recent years, semiconductor test platforms have rapidly advanced toward high-frequency operation, multi-module integration, and thermal cycling validation. With the rise of mmWave, RF, and chiplet architectures, the associated test PCBs (load boards) are facing new des...

Major Announcement: New Milestone!

2025/02/04 09:51 AM By Charles - Comment(s)
Major Announcement: New Milestone!
Newly joined Approved Vendor List (AVL) of Quanta!

The Rise of High-Density Vertical Probe Cards

2024/03/20 03:00 PM By Charles - Comment(s)
The evolution of wafer probe testing tech meets the demand for high-density vertical probe cards. Chip testing advances with MEMS-based GSG probes. Market growth is driven by complex semiconductor devices requiring precise testing.

Delving into UL EIS Class F and Its Impact on Multiple Key Industries

2023/12/13 11:00 AM By Charles - Comment(s)
UL EIS Class F upgrades electrical equipment, enhancing insulation for motors, transformers, and industrial automation. Improved efficiency, reduced energy wastage, and increased reliability make it crucial in modern electrical applications.