HCI series are high heat-resistant polyamide-imide resin solutions (Polyamide-imide, PAI). PAI is a thermosetting crystalline polymer with excellent heat resistance (Tg ≧270°C, thermal decomposition starting temperature ≧400°C), mechanical properties and chemical resistance and can form a strong coating on the surface of the object.

The solvent of HCI-100 is water + NMP. This product can be used for non-stick pan coating and lubricating coating for metal processing parts such as pistons and cams.