HDI board

HDI board

Product model：Module board

Description：

Our build-up substrate technology enables us to offer a thin multi-layer PWB based on our unique processing technology while also offering odd-layer structures (full stack-up structure).

Application：

Various Modules / Sensor / LED

Features：

Thinner and Thinner

By combining very thin prepreg materials and very thin circuits

Excellent heat dissipation for ICs

Our copper plating technology enable us to realize IVH stack structure

Fine pitch of blind via holes(IVH)

Small laser drilling and the high aspect ration filled via plating

More faster

60GHz by Low-Dk material; core filled via; Non symmetric build up

Product illustration：

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