HDI Board

Our HDI Boards are engineered to meet the demanding requirements of modern electronics, offering compact, high-density solutions with superior signal integrity, efficient thermal management, and low power consumption. These HDI boards are optimized for a range of applications, providing peak performance, enhanced reliability, and a smaller footprint.

Product model：Module board

Description：

Our build-up substrate technology enables us to offer a thin multi-layer PWB based on our unique processing technology while also offering odd-layer structures (full stack-up structure).

Application：

Various Modules / Sensor / LED

Features：

Ultra-Thin Design

Features a multi-layered, compact design that minimizes the footprint while ensuring high performance. By combining very thin prepreg materials and very thin circuits, this ultra-thin structure is ideal for modern compact electronic devices where saving space is crucial.

Superior Heat Dissipation

Our copper plating technology enable us to realize IVH stack structure

Built-in thermal vias and high-conductivity materials offer efficient heat dissipation, keeping components cool even under heavy use, thus improving reliability and device longevity.

High-Density Blind Via Holes (IVH)

Small laser drilling and the high aspect ration filled via plating

Fine pitch blind via holes (IVH) increase layer interconnection density, improving signal integrity, enabling better routing options, and providing a compact layout perfect for space-saving designs.

Advanced Multi-Layer Technology

Small laser drilling and the high aspect ration filled via plating

With support for up to 16 layers, our HDI technology provides increased design flexibility and enhanced signal routing capabilities, making it suitable for complex high-density applications.

Optimized High-Speed Performance

60GHz by Low-Dk material; core filled via; Non symmetric build up

The shorter signal paths of our HDI Board reduce latency and improve data transmission, ensuring high-speed performance for demanding high-frequency applications.

HDI board

Features：

Ultra-Thin Design

Superior Heat Dissipation

High-Density Blind Via Holes (IVH)

High-Density Blind Via Holes (IVH)

Advanced Multi-Layer Technology

Advanced Multi-Layer Technology

Optimized High-Speed Performance

Optimized High-Speed Performance

Product Illustration：